摘要
采用扫描电镜对与键合质量有关的基础材料,Si-Al丝、导电胶、外壳压点及元器件芯片压点质量的综合分析,提出元器件键合质量的高可靠性取决于基础材料的内在质量。面对21世纪电子工业的发展,加强基础材料的研究和控制,是提高军用器件高可靠性的必由之路。
The author synthetically analyzes basic material related to bonding quality, such as Si-Al wire, conductive glue, pressure welding point of shell, pressure welding point quality of component & device using scanning electron microscope, and also puts forward that the key of high reliability of component & device bonding quality lies in quality of basic material.
出处
《电子元器件应用》
2002年第1期48-52,共5页
Electronic Component & Device Applications
