摘要
通过差热分析 (DSC)研究了非等温过程环氧树脂 /液晶固化剂体系的固化反应动力学 ,研究了不同配比对固化反应的影响 ,固化反应转化率与固化温度的关系 ,计算了固化反应的活化能 ,确定了环氧树脂 /液晶固化剂的固化工艺条件 ,用偏光显微镜观察了环氧树脂 /液晶固化剂 / 4 ,4′ -二氨基二苯砜 (DDS)体系在不同温度下固化时的形态。结果表明 :液晶固化剂的加入量越大 ,固化反应速度越快 ;环氧树脂 /液晶固化剂体系固化反应的活化能为 71 5kJ/mol;偏光显微镜观察表明 :随着固化起始温度的增加 ,固化体系的形态由原来的具有各向异性的丝状结构变化为各向同性 ,液晶丝状条纹消失。
Curing kinetics of epoxy resin/liquid crystal curing agent system was studied by DSC.The effect of different formular on curing reaction,effect of curing temperature on curing conversion rate were discussed.The activation energy of the curing reaction was calculated to be 71 5 kJ/mol.POM observation of the epoxy resin/DDS/LCC curing system showed that along with the rising of initial curing temperature the morphology of the system changed from anisotropic threadlike form to isotxopic form with the disapearance of liquid crystal thread.
出处
《热固性树脂》
CAS
CSCD
2002年第2期X015-X018,共4页
Thermosetting Resin
关键词
环氧树脂
液晶
固化剂
固化反应动力学
研究
Epoxy resin
Liquid crystal curing agent
Curing kinetics
Curing reaction.
