摘要
研究了固化温度对SY H2糊状胶粘剂剪切强度的影响。首先采用差热扫描量热法 (DSC)研究了SY H2糊状胶粘剂固化反应动力学 ,根据Kissinger和Ozawa方法计算出胶粘剂的表观反应活化能分别为 10 2 3kJ/mol和 10 3 9kJ/mol,结合Crane公式求出反应级数为 0 94 3。还根据DSC分析数据研究了升温速率Φ与放热峰值温度Tp 的关系 ,研究表明Tp 与lnΦ呈线性关系。最后讨论了SY H2糊状胶粘剂固化温度对胶接试样剪切强度的影响 ,在固定的固化时间内升高固化温度有助于提高胶接强度 ,最佳固化工艺参数为 130～ 14 0℃固化 2h。
An experimental study was undertaken to determine the effects of cure temperature on shear strength of SY-H2 paste adhesive. Firstly, curing reaction kinetics of SY-H2 paste adhesive was researched by differential scanning Calorimeter(DSC). According to Kissinger and Ozawa method, the apparent activation energy of curing reactions was determined to he 102.3kJ/mol and 103.9kJ/mol respectively. Kinetic order of curing reactions calculated according to Crane method was 0.943. Furthermore, correlation of scanning rate Φ with peak temperature Tp from DSC data was found that Tp and in Φ agree with linear relation. Finally, influence of cure temperature on shear strength of SY-H2 paste adhesive was discussed. Increase of cure temperature in a given time can improve the bonding strength. Optimal curing parameter was suggested to be from 130°C to 140°C for two hours.
出处
《航空材料学报》
EI
CAS
CSCD
2002年第1期46-50,共5页
Journal of Aeronautical Materials
关键词
固化温度
SY-H2胶粘剂
影响
固化反应动力学
剪切强度
Activation energy
Bond strength (materials)
Curing
Differential scanning calorimetry
Reaction kinetics
Shear strength
