摘要
本文应用示差扫描量热和旋转粘度计等手段研究了叔胺（ＤＭＰ－３０）的羧酸复盐对酸酐固化环氧树脂体系的潜伏促进性和固化反应动力学，且与叔胺（ＤＭＰ－３０）的促进效果进行了对比。
The latent curing acceleration of the carboxylic acid double salt of tertiary amine (DMP-30) for the anhydride-curable epoxy resin system and the curing kinetics of the systems were studied by DSO and rotation viscometer; and compa- risons were made with the curing efficiency of DMP-30
出处
《中国胶粘剂》
CAS
1994年第2期7-10,共4页
China Adhesives
关键词
羧酸复盐
酸酐
环氧树脂
固化
Carboxylie Acid Double salt of DMP-30
Anhydride-Epoxy Resin
Latent
Ouring Kinetics,
