摘要
本文研究了以硼氢化钠为还原剂、乙二胺为络合刺、BGR为稳定剂的化学镀镍溶液,讨论了镀液组成和温度对沉积速度的影响,提出了获得良好镍硼合金镀层的最佳镀液组成和操作条件。
A new bath solution for electroless Ni-B alloy plating comprising sodium borohydride (as reducing agent), ethylenediamine (as complexing agent) and BGR (as stabilizing agent) is reported. The effects of composition and temperature on the rate of deposition of Ni-B alloy have also been discussed. The optimum bath composition and operating conditions for obtaining desirable Ni-B deposit are presented in the paper.
出处
《材料保护》
CAS
CSCD
北大核心
1989年第1期25-27,3,共3页
Materials Protection
