摘要
通过摸索和借鉴IPC标准自行设计了表面组装元器件标准焊盘图形 ,主要介绍了对自行设计的焊盘图形的合理性、可靠性进行验证的过程 ,将试验过程中的主要问题进行了分析 ,估算了焊点的可靠度置信下限 ,提出了焊盘可靠性设计的几点要素。
According to the Institute IPC Standard we independently designed the figure of standard soldering pad for SMT components.Mainly illustrate the testing process of the rationality and reliability of the soldering pad figure,analyze the major problems in the testing process and put forward some factors in the reliable desingning of soldering pad.
出处
《电子工艺技术》
2001年第6期256-259,共4页
Electronics Process Technology
