摘要
主要研究了 TC4钛合金镀后热处理对镀镍或铜 /镍层结合力的影响。结果表明 ,热处理后镀层与基体之间的界面形成以固溶体或金属间化合物为主的扩散层 ,采用 XRD分析扩散热处理后镀层与基体之间的界面表明 ,扩散层中存在 Ni3Ti,Ni Ti,Ni Ti2 等金属间化合物 ;镀层结合力的提高与热处理后所形成扩散层的厚度无直接关系 ,而认为其主要取决于是否有利于镀层与基体之间金属键的形成。当扩散层中的固溶体或金属间化合物足以破坏镀层与基体之间存在的氧化膜等非金属膜层的完整性 ,而镀层与基体之间的微观间隙不因热处理而增大时 ,则能促进镀层与基体之间金属键的形成 。
The effects of the post heat-treatment for electroplating on the adhesion of Ni or Ni/Cu coating were mainly studied in this thesis. The XRD results showed that the diffusion layer was formed between the coating and the base metal after the diffusion treatment, which was mainly consisted of solid solusion or intermetallic compound, such as Ni3Ti, NiTi and NiTi2. There was no direct relationship between the improvement of plating adhesion and the thickness of diffusion layer due to the formation of metallic bonds between the coating and the base metal. The metallic bonds can be easily formed and the plating adhesion can be improved when the integrality of the nonmetallic film, such as oxide film, was destroyed by the solid sulusion and metallic compound in the diffusion layer. The microcosmic clearance between the plating layer and matrix did not increase due to the heat-treatment.
出处
《稀有金属材料与工程》
SCIE
EI
CAS
CSCD
北大核心
2001年第5期388-391,共4页
Rare Metal Materials and Engineering
关键词
钛合金
电镀
热处理
结合力
镀层
titanium alloy
electroplating
heat treatment
