摘要
分析了黑瓷封装IC外引线镀锡中出现的封装玻璃发白、表面粗糙、封装玻璃与外引线连锡造成外引线极间短路的原因 。
Causes for the problems in tin plating process for exo wire of black ceramics sealed IC were discussed such as whiten of sealing glass, rough glass surface, continuous tin electrodeposits on sealing glass and exo wire. Solutions were presented.
出处
《电镀与涂饰》
CAS
CSCD
2001年第5期34-35,共2页
Electroplating & Finishing
