摘要
对陶瓷和金属连接中造成的残余应力的产生机制、计算、测量及缓解进行了较全面的介绍 :陶瓷 -金属连接的残余应力主要是由于陶瓷和金属的热膨胀系数不匹配造成的 ,其大小受多种因素影响。残余应力对陶瓷 -金属连接性能有极大影响。目前 ,对精密陶瓷中残余应力的计算主要采用有限元、边界元等数值方法 ,且主要针对简单对接接头 ,对实际工作中比较复杂的结构计算较少。在残余应力的测定方法中X射线衍射法比较成熟。而对残余应力的缓解主要采用加应力缓解层、设计合理的连接结构、采用合理的连接工艺等方法。
The mechanism of the residual stress formation and the methods of calculation,measurement and relaxation the stress are introduced completely.The different hot expand coefficient of ceramic and metal induce the residual stress in ceramic-metal joint,the value of the stress is effected by many factors.At present,finite element method and boundary element method are used to calculate the value of the residual stress in ceramics,moreover suitable for the joint joined simply,but the value of the residual stress of complicated structure is not calculated in actualy.X-ray diffraction is the mature methed of determination the residual stress in ceramic-metal joint.Adding buffer layer of stress,designing reasonable stucture and adopting reasonable tecnology are the main methods to relax the residual stress in ceramic-metal joint.
出处
《电子工艺技术》
2001年第4期166-170,共5页
Electronics Process Technology
关键词
陶瓷
金属连接
残余应力
Ceramic
Metal
Joint
Residual stress
