期刊文献+

功率晶体管芯片的电泳法玻璃钝化研究 被引量:1

The Passivation of Power Transistorchips with Electrophoresis Glass Powder
在线阅读 下载PDF
导出
摘要 本文介绍了电泳法淀积7801—5锌系玻璃粉钝化功率晶体管芯,并对电泳法原理、影响因素、玻璃粉烧结工艺进行了探讨;对钝化前后的器件做了测试;管芯反向漏电流得到改善,钝化后管芯分别在250℃和175℃温度下进行高温贮存试验取得满意结果.说明电泳法淀积7801—5锌系玻璃粉钝化工艺可提高半导体器件的稳定性和可靠性. The passivation technology of power Transistorchips using electrophoresis glasspowder(7801-5 Zinc series)is introduced.The principle of the glass powderelectrophoresis deposition method,the influences of various process factors,and thesintering process of glass powder are discussed.A comparison betweentransistorchips with glass powder passivation and without it,which provices quite satisfactory results,is made.The leakage current of the passivated transistorchipsis apparently reduced.After high temperature storage test at 250℃ and 175℃respectively,the transistorchips leakage current remains almost unchanged.The ex-perimental results show that the passivtion using glass powder 7801-5 Zinc seriescan significantly improve the transistorchips stability and reliability.
出处 《哈尔滨工业大学学报》 EI CAS CSCD 北大核心 1989年第5期88-92,共5页 Journal of Harbin Institute of Technology
关键词 功率晶体管 芯片 电泳 玻璃 纯化 Electrophoresis passivation sintering transistor.
  • 相关文献

参考文献4

  • 1陈元钦,半导体杂志,1984年,3期,35页
  • 2物理化学教程,1984年
  • 3刘万才,半导体杂志,1981年,2期,22页
  • 4华建春,上海半导体,1981年,4期,69页

同被引文献8

引证文献1

二级引证文献1

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部