摘要
对ZnO薄膜技术进行了文献综述。以喷雾热解法制备的ZnO薄膜作为中间层 ,使化学镀金属化层在高光洁度 (Ra≤ 0 .0 1μm)的无机非金属材料表面的结合力超过 2 5N/mm2 。ZnO薄膜上的光催化反应特性使其可能成为一种新的印制电路加法工艺制造技术。介绍内容包括ZnO薄膜的制备、性质、金属化工艺以及界面分析结果。
ZnO thin film technology has been reviewed. A high adhesive strength (≥25 N/mm 2) of electroless metal deposits on the very smooth ( Ra ≤0. 01 μm) non organic material substrate was obtained by taking ZnO thin film as the intermediate layer which was prepared by spray pyrolysis method. The photoca talytic reaction of ZnO thin film makes it possible to develop a new, full addit ive based process in printed circuit board (PCB) fabrication. The preparation a nd properties of ZnO film, metalization processes and the interface analysis res ults have been introduced at present paper.
出处
《材料保护》
CAS
CSCD
北大核心
2001年第8期5-7,共3页
Materials Protection
