摘要
本文以扭辫分析技术(TBA),辅助DTA方法研究了SiO_2、TiO_2添加剂对环氧树脂(E—51)/甲基四氢邻苯二甲酸酐(MTHPA)/2-乙基-4-甲基咪唑(EMI-2,4)体系固化行为以及剪切性能的影响。
The effects of SiO_2, TiO_2 additives on the curing behaviour of epoxy resin (E-51)/methyl tetrahynro o-benzene dicarboxylic (MTHPA)/2-ethyl-4-methyl imidazole(EMI-2,4) were studied by using torsion braid analysis (TBA) teehnigue and DTA. The shear, strength of this curing system was also measured.
出处
《化学工业与工程》
CAS
1991年第3期1-5,共5页
Chemical Industry and Engineering
