摘要
基于Moldflow软件,对聚碳酸酯(PC)、丙烯腈-丁二烯-苯乙烯共聚物(ABS)和PC/ABS 3种材料薄壁塑件——键盘后盖的翘曲变形进行了数值模拟。按照影响翘曲变形的工艺参数设计了正交模拟试验方案,并完成了翘曲变形的正交模拟试验。据正交模拟试验结果、用极差分析法分析了各工艺参数对翘曲变形的影响程度,得到了最佳工艺参数组合。结果表明,PC、ABS和PC/ABS键盘后盖的最佳工艺参数为模具温度分别控制在100、40、50℃,熔体温度分别为290、260、240℃,注射时间分别为2、1、2.5s,保压时间分别为25、15、25s,保压压力均为对应注射压力的110%。
The warping deformation of three back-cover of keyboards made from PC, ABS, and PC/ ABS was numerically simulated with Moldflow software. A orthogonal simulation experiment was designed and performed. The optimal process parameters were obtained by range analysis. For injection molding of PC, ABS, and PC/ABS, the mold temperature being 100, 40,and 50℃, melt temperature being 290, 260,and 240℃, injection time being 2.0, 1.0,and 2.5 s, pressure holding time being 25, 15,25 s, respectively. The holding pressure was 110 % the corresponding injection pressure for all three materilas.
出处
《中国塑料》
CAS
CSCD
北大核心
2014年第3期106-111,共6页
China Plastics
基金
湘潭大学博士启动基金(12QDZ17)
关键词
聚碳酸酯
丙烯腈-丁二烯-苯乙烯共聚物
薄壁塑件
正交试验
翘曲变形
polycarbonate
acrylonitrile-butadiene-styrene copolymer
thin-walled plastic part
or thogonal experiment
warping deformation
