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微量钕对Sn-6.5Zn/铜焊点界面组织与性能的影响

Influence of Trace Amounts of Nd on Microstructure and Performance of Sn-6.5Zn/Cu Joints
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摘要 采用SEM、EDS和拉伸-剪切试验等方法研究了微量稀土元素钕对Sn-6.5Zn-xNd(x=0,0.1,0.5)钎料/铜焊点界面组织,重点是界面金属间化合物(IMC)特征及结合性能的影响。结果表明:在Sn-6.5Zn合金中添加微量钕具有明显的变质作用,能够促进界面形成均匀细密的Cu5Zn8IMC层;钕添加量的增加对界面IMC尺寸与分布没有产生明显影响;钕添加量为0.1%(质量分数,下同)时能显著改善钎料/铜焊点结合性能,而当添加量为0.5%时,界面处稀土化合物的聚集会导致焊点结合性能下降。 The influences of trace amounts of Nd on the microstructure of Sn-6.5Zn-xNd (x=0, 0. 1, 0. 5), especially on the characteristics of intermetallic compound (IMC) and the bonding performance, were investigated using SEM, EDS and tensile-shearing testing. The results indicate that the modification effect was obvious when a trace amount of Nd was added into the Sn-6. 5Zn alloy, which can be attributed to the formation of a fine and uniform IMC layer at the interface. The increment of Nd addition had no obvious effect on the size and distribution of IMC at the interface. With the addition of 0. 1wt. % Nd, the bonding performance of the soldered joint improved markedly, but the binding ability of the soldered joint reduced because of the segregation of the Nd-rich phases in the interface when 0. 5wt% Nd was added in Sn-6.5Zn alloy.
作者 赵国际
出处 《机械工程材料》 CAS CSCD 北大核心 2014年第3期31-34,共4页 Materials For Mechanical Engineering
基金 重庆市教委科研项目(KJ132105) 重庆工业职业技术学院科研项目(GZY201210-YK)
关键词 Sn-6 5Zn钎料 界面 结合性能 Nd Sn-6.5Zn solder interface binding ability
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