摘要
本文通过拉伸试样的原始标距、拉伸速度、断口位置等因素对半导体键合用金丝、铝硅合金丝((φ0.02～0.1mm)的力学性能影响进行了探讨,并用扫描电镜对在两种拉伸速度下获得的断口做了微观分析,用千分尺,称重法和激光测径仪对微细丝的直径测量进行了比较。
The effects of tensile testing parame- ter on mechanical properties of gold wire and Al-Si alloy fine wire(0.02mm ～0.1mm)used for semicorductor bonding wire are discussed.The tensile testig pa- rameters include original gauge length, tensile apeed,fracture position of simple. Fracture surfaoes obtained under two ten- sile speeds are analyzed by means of scanning electron microscope.Also the diameters measured by micrometer,weight method and ultra-fine wire gauge are compared.
出处
《功能材料》
EI
CAS
CSCD
1991年第3期160-167,共8页
Journal of Functional Materials
