摘要
介绍半导体模具从单注射头模具发展到双注射头模具、多注射头模具,以及其它封装方式等;通过单注射头模具与双注射头模具、多注射头模具进行比较,可以明确半导体模具发展必然进程,体现出现代半导体模具市场确实是按模具的先进性进行分配市场份额,从而推动半导体模具发展历程。
This paper introduces the semiconductor die from a single injection mould to double injection mould,multi injection head mold,and other packaging methods; through the comparison of single injection mould with double injection mould,injection mould multi head,can clear the semiconductor die development inevitable process,embody the modern semiconductor die market are allocation of market share by advanced mold,so as to promote the development of semiconductor die.
出处
《电子工业专用设备》
2013年第12期21-23,共3页
Equipment for Electronic Products Manufacturing
关键词
半导体模具
单注射头
多注射头
免预热
自动封装
Semiconductor die
Single injection head
Multi injection head
Preheating free automatic packaging
