摘要
通过对不同钎料层厚度（15～50μm）的Cu／SAC305／Cu三明治结构焊缝进行高温时效处理，研究在高温时效过程中钎料层厚度对IMC生长行为的影响．结果表明，钎料层厚度对高温时效过程中的界面元素同态扩散的影响显著．钎料层厚度越小，在时效过程中界面处越有利于Cu6Sn5的生长，160℃时效相同时间后Cu6sn5层与cu，sn层的厚度比越小；时效过程中IMC层（Cu6Sn5层＋Cu3Sn层）的叶。长速率随着针料层厚度的减小也呈现减小的趋势；扩散系数受钎料层尺寸的影响，扩敞系数与钎料屡厚度之间近似满足抛物线关系．
The relation between solder thickness and the growth behavior of IMC during HTS(high-temperature storage) aging was investigated with Cu / SAC305 / Cu sandwich structures at different solder thicknesses(15 ~ 50 μm).The results indicated that the solid state diffusion of interfacial elements is greatly dependent upon solder thickness during HTS aging.The thinner the solder layer is,the faster the Cu 3 Sn layer grows,which leads to a thickness ratio decrease of Cu 6 Sn 5 / Cu 3 Sn after HTS aging at 160 ℃.The growth rate of IMC layer(Cu 6 Sn 5 layer + Cu 3 Sn layer) also decreases with the decrease of solder thickness during HTS aging.The diffusion coefficient is in relation with the size of solder layer.Further data correlating indicates that the alternation regularity between diffusion coefficient and solder thickness is approximately accordance with parabolic correlation.
出处
《焊接学报》
EI
CAS
CSCD
北大核心
2013年第12期75-78,5,共4页
Transactions of The China Welding Institution
基金
国家自然科学基金资助项目(51075107
51174069)
关键词
高温时效
界面金属间化合物
扩散系数
几何尺寸效应
high-temperature storage aging
intermetallic compounds
diffusion coefficient
geometrical size effect
