摘要
采用复合铸造方法制备了银包铜复合材料,研究了扩散退火温度和时间对复合材料显微组织和扩散层厚度的影响。结果表明:随着扩散热处理温度升高和保温时间的延长,扩散层厚度逐渐增加,在500℃和600℃保温60 min,出现了界面组织的球化现象。扩散层厚度与扩散处理时间的平方根成正比,扩散层生长激活能为51.9 kJ/mol。
The Ag clad Cu composite materials were prepared by the method of composite casting. The influences of diffusion annealing temperature and annealing time on microstructures and thickness of diffusion layer were studied. The results show that thickness of diffusion layer increased with the increasing temperature and time. The interface structure appears phenomenon like spheroidizing structure at 500℃ and 600℃ for 60 min. The thickness of diffusion layer is proportional to the square root of time and the growth activation energy of diffusion layer is about 51.9 kJ/mol.
出处
《贵金属》
CAS
CSCD
北大核心
2013年第S01期52-55,共4页
Precious Metals
基金
云南省省院所技术开发专项(2011CF012)
昆明市科技创新团队项目(2012-01-01-A-R-07-0005)资助
关键词
金属材料
银包铜复合材料
扩散退火
显微组织
扩散层
生长激活能
metal materials
Ag clad Cu composite materials
diffusion annealing
microstructures
diffusion layer
the growth activation energy
