摘要
利用Thermorestor-W焊接热模拟试验机,采用适当的焊接参数和工艺,能够用铝合金中间层固相扩散连接Si_3N_4和低碳钢。在连接温度下,铝合金Si_3N_4进入孔洞中形成机械连接,而铝合金与Si_3N_4连接的主要机理是铝与Si_3N_4发生固相反应生成AlN。当温度大于530℃时,铝合金/Si_3N_4界面Al,Si扩散层厚度基本上不随温度升高而变化。Si_3N_4/铝合金/低碳钢接头的剪切强度取决于铝合金/钢界面强度,且随扩散连接温度上升而增加。
Silicon nitride and low carbon steel can be well bonded with an aluminum alloy inter layer using proper bonding processes and parameters in Thermorestor-W weld thermal simulator. At the bonding temperature, the aluminum alloy enters the porosities in silicon nitride to make a mechanical bonding, the main mechanism of bonding being the forming of aluminum nitride. When the bonding temperature exceeds 530'C ,the thickness of Al,Si diffusion layer changes a little as the temperture increses. The shear strength of the bond depends upon that of the aluminum/steel interface and increases as the temperature rises.
出处
《甘肃工业大学学报》
1991年第4期39-46,共8页
Journal of Gansu University of Technology
关键词
铝合金
中间层
陶瓷
低碳钢
焊接
ceramics, bonding, low carbon steel, silicon nitride, solid phase diffusion welding, diffusion, aluminum alloy inter layer
