摘要
利用Ｔｈｅｒｍｏｒｅｓｔｏｒ－Ｗ焊接热模拟试验机，采用适当的焊接参数和工艺，能够用铝合金中间层固相扩散连接Ｓｉ３Ｎ４和低碳钢。在连接温度下，铝合金进入Ｓｉ３Ｎ４孔洞中形成机械连接，而铝合金与Ｓｉ３Ｎ４连接的主要机理是铝与Ｓｉ３Ｎ４发生固相反应生成ＡｌＮ。当温度大于５３０℃时，铝合金／Ｓｉ３Ｎ４界面Ａｌ、Ｓｉ扩散层厚度基本上不随温度升高而变化。Ｓｉ３Ｎ４／铝合金／低碳钢接头的剪切强度取决于铝合金／钢界面强度，且随扩散连接温度上升而增加。
Silicon nitride and low carbon steel can be well bonded with an aluminum alloy interlayer u#ing proper bonding processes and parameters in Thermorestor-W weld thermal simulator. At the bonding temperature,the aluminum alloy enters the porosities in silicon nitride to make a mechanical bonding,the main mechanism of bonding being the forming of aluminum nitride. When the bonding temperature exceeds 530C,the thickness of Al,Si diffusion layer changes a little as the temperature increases.The shear strength of the bond depends upon that of the aluminum/steel interface and increases as the temperature rises.
出处
《机械工程材料》
CAS
CSCD
1994年第2期46-50,共5页
Materials For Mechanical Engineering
