摘要
提出基于溶胶凝胶原理制备大面积细粒度磨削与抛光工具的方法。比较了凝胶结合剂工具与烧结式金属结合剂工具在分散细粒度磨粒方面的效果,并将所制备的凝胶工具用于单晶硅片和天然石材的磨抛加工。结果表明,凝胶工具中磨粒分散的均匀性较烧结式工具有明显改善。与游离磨料加工相比,采用凝胶工具的磨抛加工能够更加高效率地获得更低粗糙度的单晶硅片表面。凝胶工具在加工硬质花岗石材时的材料去除能力不足。但是,在加工大理石材料时能够获得满意的表面光泽度。在初期磨抛阶段,凝胶工具磨损以磨粒磨损方式为主,随着加工过程的进行,会出现一定程度的磨料脱落。
Based on the principle of sol-gel, a method is proposed to fabricate large size grinding and polishing tools containing fine abrasives. The effects in the dispersing of fine abrasives in bond matrix are compared for the gel-bonded abrasive tools and sintered metal-bonded abrasive tools. The gel-bonded tools are used for the grinding and polishing of silicon wafers and natural stone materials. It is found that the gel-bonded tools are superior to the sintered tools in dispersing fine abrasives. As compared to the sintered tools, much lower surface roughness can be obtained with high efficiency while grinding and polishing silicon wafers by the gel-bonded tools. But, the gel-bonded tools are poor in terms of material removal and surface gloss readings while machining of hard granite. When the gel-bonded tools are used for marble, however, satisfactory surface gloss readings can be obtained. During the initial period of machining, the gel-bonded tools fail mainly in the form of abrasion whereas a number of abrasives detach from the gel bond as the machining process proceeds.
出处
《机械工程学报》
EI
CAS
CSCD
北大核心
2013年第19期156-162,共7页
Journal of Mechanical Engineering
基金
国家自然科学基金资助项目(U1034006
51075159)
关键词
凝胶工具
细粒度磨粒
磨抛加工
硅片
石材
Gel-bonded tool Fine abrasive Grinding and polishing Silicon wafer Stone
