摘要
目的:观察半导体激光联合复方黄柏液外用治疗皮肤溃疡,促进创面愈合的临床效果。方法将我科收治的52例皮肤溃疡患者,随机分为联合治疗组、单用激光对照组和单用复方黄柏液对照组,治疗组在常规处理创面的基础上,给予半导体激光照射后,用无菌复方黄柏液纱布覆盖或填塞,观察创面愈合时间及治疗效果。结果治疗组治愈率及有效率均高于对照组(p<0.01,p<0.05),治疗组治愈平均时间明显短于对照组(p<0.01)。结论:半导体激光照射联合复方黄柏液治疗皮肤溃疡可提高治愈率,缩短平均住院日。
Objective： To study the curative effect of semiconductor laser combined with colnpound huangbai solution in the treatment of skin ulcer. Methods： Fifty-two cases suffered with skin ulcer were divided into combined therapy group, laser group and compound huanghai solution group. The patients in the combined therapy group were performed first with local debridement and routine treatment, then covered or filled with sterile gauze which moistened by compound huangbai solution besides semiconductor laser radiation, the recovery time and the curative effect was compared with the control groups. Results： The curative rate and effective rate in the combined therapy group were higher than in the control groups （ p 〈 0.01, p 〈 0.05 ）. The mean recovery time in the combined therapy group was shorter than in the control groups （ p 〈 0. 01）. Conclusion： semiconductor laser combined with compound huangbai solution in treatment with skin ulcer can improve curative effect, shorten average hospital duration.
出处
《激光杂志》
CAS
CSCD
北大核心
2013年第5期72-73,共2页
Laser Journal
关键词
半导体激光
复方黄柏液
皮肤溃疡
semiconductor laser
compound huangbai solution
skin ulcer
