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EC104环氧胶灌封工艺研究 被引量:1

Research of the Potting Process for Epoxy Adhesive EC104
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摘要 文章介绍了环氧胶的特点和灌封方式,选择了一种适合多品种、小批量产品的挑胶热风吹灌方式,针对EC104环氧胶灌封后产生气泡的原因进行了分析,确定了其基体和固化剂的最佳配比,优化了灌封工艺流程,并采用梯度升温、分段固化的方式,有效提高了EC104环氧胶的灌封质量,使其满足恶劣环境下的使用要求。 The epoxy adhesive is introduced in terms of features and potting methods. The potting with hotwind blowing method was chosen in order to meet the requirement for products with many kinds and few in a batch. The reasons for air bubbles occur after potting with EC104 were discussed, and the best ratio of base and curing a- gent was determined. With optimizing the traveler of potting and curing in different temperature, the quality for pot- ting with EC104 was enhanced which insure the products can be used in harsh environment.
出处 《机电元件》 2013年第4期36-39,共4页 Electromechanical Components
关键词 EC104环氧胶 灌封 脱泡 EC104 epoxy adhesive, potting, elimination of air bubbles
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