摘要
本文研究了铜及其合金在稀酸溶液中化学抛光的效果,并对酸的种类、浓度、过氧化氢、脂肪醇、温度、时间等的影响进行了讨论.认为合适的化学抛光溶液和工作条件为:H_2SO_42～6mL/L,H_2O_2100～150mL/L,乙醇40～60mL/L,时间15～30分,温度15～35℃.
Process for chemical polishing of Cu and its alloys in watery acid was investigated through observation of the polished samples. Effects of constituents, concentration and working conditions of the solution on polishing quality were studied, resulting in a suggested solution which comprises H_2SO_4 2～6 mL/L, H_2O_2 100～150 mL/L, ethanol 45～60 mL/L anb works at 15～35℃ for 15～30 min.
出处
《电镀与涂饰》
CAS
CSCD
1991年第3期33-38,共6页
Electroplating & Finishing
