摘要
本文通过大量试验数据及图表论述了化学镀Ni-Cu-P合金镀液的性质,即镀液中的主要组成、镀液的pH、施镀温度对镀层的沉积速度、镀层中Ni、Cu、P百分含量的影响;从热力学观点说明了镀液pH,施镀温度对镀层中Ni、Cu、P百分含量影响变化规律;试验测得了化学镀Ni-Cu-P合金总沉积反应的表观活化能△E为47.000kJ.mol^1;当施镀温度为80±2℃,pH在7.50时,Ni、Cu、P的原子沉积比例为11.23:1.00:2.31。
Characters of Ni-Cu-P alloy electroless plating bath were investigated through a great deal experiments. Influence of component and pH of the bath and operating temperature on the deposition rate of the alloy and on the percentage content of Ni, Cu and P in the coating was discussed. The relation between pH and temperature of the bath and the percen-tage content of Ni,Cu and P in the coating was explained from the view point of thermodynamics, The apparent activation energy for the deposition of Ni-Cu-P alloy from the electroless plating bath chosen was calculated from the experimental data and a value of 47.000kJmol^(-1) was obtained. The deposition ratio in atom of Ni,Cu and P was obtained to be 11.23: 1. 00: 2. 31 for the alloy deposited under conditions of pH 7. 5 and temperature 80℃.
出处
《电镀与精饰》
CAS
1991年第2期8-13,共6页
Plating & Finishing
