摘要
本文对现代印制电路电镀和蚀刻工艺中所发展的前沿技术,通过总结从七个方面进行介绍和论述:(1)穆斯堡尔谱学对沉积层的应用;(2)光亮剂浓度的监测;(3)化学镀铜液的净化;(4)保护镀层的变更;(5)激光一电气法孔金嘱化;(6)脉冲电镀;(7)有机蚀刻剂的应用。作者认为,对这些新兴技术的研究和探索,将对印制电路的加工产生重大的影响。
Update state of arts developed in electroplating and etching of modern PCB is reviewed in seven aspe- cts:1.application of Mssbauer spectroscopy to deposition,2.monitoring of brightner concentration,3.puri- fication of electroless Cu bath,4.change of protective coatings,5.laser-electrical hole metallization,6.pulse plating,7.application of organic etching agents.It is considered that significant effects on processing of PCB would be made by studying and probing of above-mentioned developing technologies.(p.1-3)
出处
《电镀与环保》
CAS
CSCD
1991年第4期1-3,共3页
Electroplating & Pollution Control
