摘要
RTM和预浸料两种工艺共固化会形成一个界面层,采用差热分析和红外光谱研究环氧树脂/酸酐和环氧树脂/双氰胺共固化体系的反应,采用正电子湮没技术测试了共固化体系所形成界面中的自由体积尺寸和浓度。结果表明,单独体系的反应峰大约是160℃,两种工艺树脂混合后,反应峰向高温方向移动,为275.14℃;同时放热量从RTM体系的236.2J/g和预浸料体系的193.9J/g降低至83.15J/g;界面层的自由体积尺寸和浓度比两个单独固化体系的大,弯曲强度分别从RTM体系的140.2MPa和预浸科体系的105.4MPa降至83.4MPa。两种体系的固化剂相互反应,致使共固化体系反应不完全,形成一个力学性能较低的共固化界面层。
There was an interface when the RTM and prepreg process was co cured. Interphase reaction of RTM and prepreg process was investigated by differential scanning calorimetry （DSC）and fourier transform-infrared （FTIR） spectrometer analysis. The size and concentration of free volume were tested by positron annihilation spectroscopy. As a result, the reaction peak of the RTM and prepreg process is 160 , and reaction peak of co curing system is 275.14 ℃. Heat release of RTM, prepreg and co-curing is 236.2 J/g, 193.9 J/g and 83.15 J/g, respectively. Free volume size and concentration of cocuring system are larger than RTM and prepreg process. Bending strength of co-curing system is 83. 4 MPa, which is less than RTM （140. 2 MPa） and prepreg process （105.4 MPa）. Curing agents of RTM and prepreg process react each other and lead to a weak interphase.
出处
《复合材料学报》
EI
CAS
CSCD
北大核心
2013年第3期35-38,共4页
Acta Materiae Compositae Sinica
基金
973项目(2010CB631104)
西北工业大学研究生创业种子基金(z2012146)
关键词
共固化
RTM工艺
预浸料
界面
正电子湮没技术
自由体积
co curing system RTM process prepreg process interface positron annihilation technique free volume
