期刊文献+

镀金与无氰镀金应用述评 被引量:18

Gold-plated and Cyanide-free Gold-plating Application Review
在线阅读 下载PDF
导出
摘要 简述了镀金历史与应用情况,镀金以其贵金属的特质,作为高级装饰性镀层和功能性镀层,无论是在传统产品领域还是在现代制造领域,都有重要的应用价值。特别是在现代电子制造和微制造中,有着重要的应用。为了环境安全而开发的无氰镀金,近年也有一些新进展,但要完全替代传统镀金工艺,尚需要进一步改进。 The history and application of gold-plating were briefly introduced as senior decorative coating and functional coating, has important application products field or in modem manufacturing field due to its precious metal traits. in this paper. Gold-plating, value whether in traditional Especially in the electronic manufacturing and micro manufacturing, gold-plating has important applications. For the sake of environmental safety, cyanide-free gold-plating has been developed and made some new progress in recent years, but it still need further improvement for replacing traditional gold-plating process completely.
作者 刘仁志
出处 《电镀与精饰》 CAS 北大核心 2013年第5期23-26,共4页 Plating & Finishing
关键词 镀金 无氰镀金 电子电镀 gold-plating cyanide-free gold-plating electroplating of electronic products
  • 相关文献

参考文献7

二级参考文献23

  • 1李东亮.银、金、铂的性质及应用[M].北京:高等教育出版社,1998.56-60.
  • 2Green T A. Gold Electrodeposition for Microelectronic, Op- toelectronic and Microsystem Applications [ J ]. Gold Bulle- tin, 2007, 40(2) : 105 - 114.
  • 3Kato M, Okinaka Y. Some Recent Developments in Non- Cyanide Gold Plating for Electronics Applications [ J ]. Gold Bulletin, 2004, 37 ( 11 ) : 37 - 44.
  • 4Osaka T, Okinaka Y, Sasanoc J. Development of new elec- trolytic and electroless gold plating processes for electronics applications [ J ]. Science and Technology of Advanced Ma- terials, 2006, 7 (5) : 425 - 437.
  • 5Honma H, Hagiwara K. Fabrication of Gold Bumps Using Gold Sulfite Plating[J]. Journal of the Electrochemical So- ciety, 1995, 142(1): 81-87.
  • 6Watanabe H, Hayashi S, Honma H. Microbump Formation by Noncyanide Gold Electroplating[ J ]. Journal of the Elec- trochemical Society, 1999, 146(2) : 574 -579.
  • 7Honma H, Kagaya Y. Gold Plating Using the Disultlteaurate Complex [ J ]. Journal of the Electrochemical Society, 1993, 140(9) : 135 - 137.
  • 8中华人民共和国航天工业部部标准QJ459-88.金镀层技术条件[S].[S].,1988-12-28发布,1989-08-01实施..
  • 9GEMMIER A, KELLER W, RITCHER H, et al. High-performance gold plating for microdevices [J]. Plat Surf Finish, 1994, 81 (8): 52-58.
  • 10HONMA H, KAGAYA Y. Gold plating using disulfiteaurate complex [J]. J Electrochem Soc, 1993, 140 (9): L135-L137.

共引文献23

同被引文献160

引证文献18

二级引证文献57

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部