摘要
随着IGBT功率模块的广泛应用,其功率循环可靠性问题得到关注和重视。介绍了模块的功率循环失效机理,指出铝键合线剥离是模块功率循环失效的原因;基于有限元法计算了模块在功率循环过程中的温度分布与变化,并在此基础上计算了模块的应力应变;根据应力应变数值的计算结果,分别采用应变能法和应变法等两种疲劳破坏准则,预测了键合线疲劳寿命。研究表明,铝键合线根部为模块的疲劳危险区;随着芯片热损耗的增加,芯片结温变化幅度的增加,功率模块疲劳寿命急剧地减小。
The power cycle reliability of IGBT Modules is paid more and more attention because of its widely use. In this paper, the failure mechanism of power modules is introduced, and the aluminum wire bond lift-off is the cause of the power cycle failure of power modules. FEA was used to investigate the temperature distribution and change of the module during power cycle; stress and strain of module is computed based on the result of thermal simulation. According to the result of stress and strain of module, lifetime of aluminum wire bond is estimated. It is shown that the heel of the aluminum wire increase of thermal dissipation bond is the fatigue danger zone of the module. With the of IGBT chip, the range of the chip＇s temperature increases, and the lifetime of power module decreases rapidly.
出处
《电子产品可靠性与环境试验》
2013年第2期12-17,共6页
Electronic Product Reliability and Environmental Testing
关键词
功率循环
铝键合线
有限元法
疲劳寿命
power cycle
aluminum bond wire
finite element method
fatigue lifetime
