摘要
文章通过总结众多相关文献的研究成果和实际引线键合工艺中的经验心得,为读者呈现较全面的有关引线键合的介绍,包括键合时序、机台动作、关键键合参数、键合材料特性、键合工具的设计、键合机理等方面。在对一些常见的工艺问题(如不烧球、高尔夫焊点、短线尾、焊点不粘等)分析的基础上,讨论其解决方案和最近研究进展;同时也关注了铜引线键合技术发展中存在的一些问题。由于作者能力及文章篇幅的限制,仅对关键工艺及因素进行了探讨,希望能帮助读者深入了解引线键合工艺,并对实际工艺问题的解决和键合理论机理的研究有所益处。
This paper attempted to integrate both reviewing on recent literatures and actual experiences in wire bonding process and provide a comprehensive review on bonding procedure, bonder motions, key bonding parameters, properties of bonding materials, designs of bonding tools as well as joining mechanism. At the same time some issues such as EFO-open, golf bond, short tail, non-stick on pad and lead were analysed; the solutions and recent developments to these issues were discussed. In addition, the application and special points of copper wire in wire bonding were also focused on. Because of the limitation of paper p^ge, only key process factors were reviewed briefly; while this paper provided an opportunity to understand wire bonding well and brought a great benefit to the solving of whether actual operation issues or basic bonding principles.
出处
《电子与封装》
2013年第3期1-8,共8页
Electronics & Packaging
关键词
引线键合
时序
参数
劈刀设计
键合机理
工艺问题
铜线
wire bond
procedure
parameter
capillary design
joining mechanism
bonding issue
copper
