期刊文献+

微谐振器结构性能的有限元分析

Finite Element Analysis of Oscillating Microresonators
在线阅读 下载PDF
导出
摘要 微谐振器是试飞测试系统的重要组成部件,微谐振器的性能影响到试飞测试系统的精确度。为了提高微谐振器的性能,在传统结构的基础上,提出改变微谐振器中折叠梁、驱动梳齿等结构的尺寸来改善其性能。运用有限元法对不同结构尺寸下的微谐振器进行模态、品质因子分析。仿真结果表明,横向微谐振器的一阶模态频率的大小很大程度上受到折叠梁尺寸的影响;静电梳齿的尺寸设计中,梳齿的宽度是影响驱动力和品质的一个关键因素。仿真结果表明,对提高微谐振器的性能具有一定的指导意义。 The micro- resonator is the key component of the flight test system, the performance of the micro -resonator affects the accuracy of the flight test system. In order to improve the performance of the micro - resonator, based on the traditional structure, this paper proposed a method which changs the size of the folding beam and the drive comb structure in micro -resonator. By using finite element method, we analysed the micro resonator's modal and quality factor at different dimensions. The simulation results show that the first - order modal frequency of the transverse micro - resonator is largely affected by the size of the folded beam. In the design of the electrostatic comb' size, the comb width is a key factor that affects the driving force and the quality factor. Ideas and the simulation results in this paper have a guiding significance for improving the performance of the micro - resonator.
出处 《计算机仿真》 CSCD 北大核心 2013年第2期89-92,共4页 Computer Simulation
关键词 微谐振器 折叠梁 有限元 Micro - resonator Folded beam Finite element
  • 相关文献

参考文献6

  • 1W C Tang. Electrostatic Comb Drive for Resonant Sensor and Actuator Applications[D].Berkeley:Univercity of Califorlia,1990.351-360.
  • 2R T Howe,B E Boser,A P Pisano. Poly silicon Integrated Micr-osystems[J].Techlonogies and applications Sensors and Actuators A,1996,(1-2):167-197.
  • 3李锦明.电容式微机械脱落仪设计[M]北京:国防工业出版社,2006.
  • 4周镇威,杨卓青,蔡豪刚,丁桂甫.带有凸条平板的MEMS结构压膜阻尼效应分析[J].传感技术学报,2010,23(5):665-669. 被引量:3
  • 5中国科学院多相反应重点实验室.微流动基础与模拟[M]北京:化学工业出版社,2006.
  • 6刑静忠.ANSYS应用实例与分析[M]北京:科学出版社,2006.

二级参考文献12

  • 1王卫东,贾建援.微流体对中心开孔圆盘的阻尼特性[J].西南交通大学学报,2006,41(2):218-222. 被引量:3
  • 2Newell W.Miniaturization of Tuning Forks[J].Science,1968,161:1320-1326.
  • 3Trimmer W S N.Microrobots and Micromechanical Systems[J].Sensors Actuators,1989,19(3):267-287.
  • 4Bao M.Analysis and Design Principles of MEMS Devices[M].Amsterdam:Elsevier,2005,115-174.
  • 5Blech J J.On Isothermal Squeeze Films[J].ASME J.Lubric.Technol.1983,105:615-620.
  • 6Bao M,Yang H.Squeeze Film Air Damping in MEMS[J].Sen-sors Actuators A,2007,136(1):3-27.
  • 7Gross W A,Matsch L A,Castelli V,et al.Wildmann,Fluid Film Lubrication[M].New York:John Wiley & Sons,1980.
  • 8Starr J.Squeeze Film Damping in Solid-State Accelerometers[C]//IEEE Workshop on Solid-State Sensor and Actuator.Hil-ton Head Island,SC,USA,1990:44-47.
  • 9Bao M.Micro Mechanical Transducers--Pressure Sensors,Acceler-ometers and Gyroscopes[M].Amsterdam:Elsevier,2000,89-137.
  • 10Wycisk M,Binder J,Michaelis S,et al.New Sensor On-Chip Technology for Micromechanical Acceleration-Threshold Switches[J].Proceedings of SPIE,1999,3891:112-120.

共引文献2

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部