摘要
提出了在氨水—硫酸铵体系下鼓入空气浸出废旧电路板中铜的新工艺。考察了氨水浓度、硫酸铵浓度、固液比、反应温度、通入空气流量和浸出时间对铜浸出率的影响。结果表明,在下述最佳浸出条件下,渣计铜浸出率达到96.67%:氨水浓度2mol/L,硫酸铵浓度2mol/L,固液比1∶20,反应温度25℃、通入空气量8m3/h、浸出时间4h。
A novel hydrometallurgical process of copper recovery from waste printed circuit boards was in- troduced. In this process, air was blown into solution as oxidant for copper leaching in NH3-（NH4）2SO4- H2O system, while leaching residue was treated by physical method. The effects of ammonia and ammoni- um sulfate concentration, ratio of solid to liquid, leaching temperature, air flow and leaching time on cop- per leaching rate were investigated. The results show that copper leaching rate is up to 96.67% under the following optimum conditions including ammonia concentration of 2 mol/L, ammonium sulfate concentra- tion of 2 mol/L, ratio of solid to liquid of 1 ： 20, leaching temperature of 25 ℃, air flow of 8 m3/h and leaching time of 4 h.
出处
《有色金属（冶炼部分）》
CAS
北大核心
2013年第1期17-20,共4页
Nonferrous Metals（Extractive Metallurgy)
关键词
废旧电路板
空气氧化
氨浸
铜
waste printed circuit boards
air oxidation
ammonia leaching
copper
