摘要
通过 X射线衍射和 XPS对电磁线绝缘膜下表面黑膜及模拟腐蚀试样的表面膜进行了分析 ,测得表面黑膜主要由 Cu2 O、Cu O、Cu CO3、Cu(OH) 2 、Cu的氯化物和硫化物以及钠盐、Si O2 等组成。
The surface tarnishing film of copper electromagnetic strip under dielectric cladding was measured by X Ray Diffraction(XRD)and X ray Photo electron Spectroscopy (XPS) The results showed that the surface tarnishing film consisted of Cu 2O、CuO、CuCO 3、Cu(OH) 2, chloride and sulphide of copper, sodium salts and silicon dioxide The present work studied the causes for surface tarnishing of copper under dielectric cladding
出处
《腐蚀与防护》
CAS
2000年第8期373-375,共3页
Corrosion & Protection
关键词
铜
电磁线
绝缘膜
腐蚀
绝缘层
表面发黑
Copper Electromagnetic strip Dielectric film Corrosion Tarnish
