摘要
以示差扫描量热仪 (DSC)为主要研究手段 ,研究了环氧封端聚芳醚酮 (E- PEK)、双酚 A型环氧树脂 (E- 44 )的玻璃化转变温度 (Tg)和比热 (Cp)与温度和反应程度的关系。采用基团贡献法对上述材料的 Tg 和 Cp 进行了预测 ,引入端基和固化剂的影响对基团贡献法进行了修正。
The thermal physical properties(glass transition temperature T g and specific heat p) of epoxy terminated poly(phenylene ether ketone) and bisphenol A epoxy resin were studied using a differential scanning calorimeter. At the same time, T g and C p were also predicted based on the group contribution method. The prediction results of T g for both fresh sample of epoxy resin and cure agent and fully cured sample are not satisfactory. Therefore, the contribution of the end group in epoxy resin and the cure agent was introduced in the prediction process and the group contribution method was modified.
出处
《高分子材料科学与工程》
EI
CAS
CSCD
北大核心
2000年第4期65-68,共4页
Polymer Materials Science & Engineering
基金
河北省教委博士基金资助项目
中科院高分子物理联合开放研究实验室科学基金资助课题
关键词
环氧树脂
固化
热物理性能
比热
热固性高聚物
epoxy resin
the extent of cure
thermal physical properties
glass transition temperature
specific heat
