摘要
在一定的温度下 ,由于适量的氧元素的引入 ,铜的表面将形成一层Cu Cu2 O共晶熔体 ,通过这一共晶熔体可以将铜与许多陶瓷键合在一起。研究了铜与氮化铝陶瓷直接键合的可行性 ,运用扫描电镜 (SEM )、电子能谱(EDX)对键合机理作了一定的分析和探讨。
Cu Cu 2O eutectic would be formed on the surface of the copper due to the introduction of proper oxygen at high temperature.Copper would be bonded directly on many ceramics through this eutectic.In this paper,the possibility of copper direct bonding to aluminum nitride substrate is studied,and the bonding mechanism is investigated by means of SEM and EDX.
出处
《电力电子技术》
CSCD
北大核心
2000年第3期55-56,60,共3页
Power Electronics
