摘要
通过在化学镀铜液中分别添加亚铁氰化钾、２ＭＢＴ及２，２’－联吡啶三种添加剂的实验研究，探讨了添加剂种类及其加入量对镀铜速度和镀铜层延展性产生显著影响的原因。此外。
The addition of additives K 4Fe(CN) 6,2MBT and dipyridyl into plating solutions was studied.It was found that they have effects on plating rate,ductility and antiwear of copper layer.
出处
《化学世界》
CAS
CSCD
2000年第1期13-18,共6页
Chemical World
关键词
化学镀铜
添加剂
延展性
镀速
耐磨性
铜镀层
chemical plating copper
additives
ductility
plating rate
antiwear property
