摘要
数字后端物理版图设计是整个芯片设计的关键一步,而减少设计时所用的金属层数是IC行业中缩减芯片成本的一个重要措施。本文以SMIC0.18μm工艺下一款SmartCard芯片的实际设计方案为例,首先分析了金属层数与成本的关系,之后分析其可行性,并提出了具体的布局布线方案,最终以成功的流片结果论证了该减少金属层数设计方案的可行性。
Digital backend layout design is a key step in the whole chip design, and one of the important measures to cut the chip cost is reducing metal layers in the design. Based on the design of a smartcard chip in SMIC 0.18μm technology, this paper analyzed the relation between metal layers and cost, and the feasibility of reducing metal layers, then put forward a design scheme. Finally, the results of successful tapeout proved the feasibility of this scheme.
出处
《科技信息》
2012年第11期66-66,18,共2页
Science & Technology Information
