摘要
介绍了无铅化推广以来无铅工艺研究的紧迫性;开展了多种封装阻容器件的焊接实验工作;通过对焊点剪切力性能的对比和分析,总结了焊接时间对于焊点改善焊接质量的作用;通过观察不良焊点的剪切力试验断面图和微观视图,阐述了焊接时间对于改善焊点质量的原因;发现在本实验条件下,适当延长手工焊接时间,有助于改善焊点质量。
The urgency of researching on lead-free technology is introduced since lead-free manufacture has been spread. The soldering experiment on several kinds of package resistances and capacitances is made. Contrast and analyze the shearing performance, the effects of boding time on improving the quality of solders are summarized. By observing the pictures of bad solders, the factors of soldering time on improving solder quality are elaborated. Under the condition of this experiment, prolonging bonding time suitably can improve the solder quality.
出处
《电子工艺技术》
2012年第2期79-81,共3页
Electronics Process Technology
基金
中国科学院知识创新工程领域前沿项目资助
关键词
无铅
焊接工艺
剪切力
Lead-free
Bonding Technology
Shearing
