摘要
运用基于CFD的热仿真软件Flotherm对液冷模块进行了热仿真分析,分别研究了在不同环境温度,不同冷却液流量以及不同冷却液温度条件下,液冷模块内部温度场的变化规律。仿真分析结果表明,环境温度对液冷模块的温度场影响非常小;液冷模块冷却液流量的增幅与元器件温度的降幅并非正比关系;元器件温度的升幅与冷却液温度的增幅相同。
Some Liquid Cooling Module was analysed by CFD Software Flotherm.The temperature variation of the module under different ambient temperature,coolant flow and coolant inlet temperature was studied.The results showed that the influence of the ambient temperature is very small,the increasing of the coolant flow and the reduction of the chip temperature is not a direct proportion relation and the temperature rise of the chip is the same as the coolant inlet temperature rise.
出处
《航空计算技术》
2012年第1期132-134,共3页
Aeronautical Computing Technique
基金
武器装备预研基金项目资助(9140A160608HK61)
关键词
液冷模块
热分析
温度场
元器件
liquid cooling module
thermal analysis
temperature field
chip
