摘要
采用水淬法对以Na2O-B2O3-SiO2体系玻璃焊料连接的常压烧结碳化硅试条的抗热震性能进行了研究.对不同温度下淬火后接口以及断面处微观结构进行了比较与分析,并对比了不同淬火温度以及固定淬火温度为150℃时多次热循环后连接试条的残余弯曲强度.结果表明,对于单次淬火,当淬火温度为150℃时,由于热应力引起中间层内部微裂纹扩展,导致残余弯曲强度迅速降低到（152±28）MPa.淬火温度在150℃~320℃时,中间层内部裂纹保持在亚临界状态,相应弯曲强度基本保持在140 MPa.继续升高淬火温度至420℃时,裂纹进一步扩展,试条残余弯曲强度迅速降低至（32±8）MPa.对于多次热循环,当淬火温度固定在150℃时,经多次热循环,残余弯曲强度与热循环次数变化不明显,基本保持在120 MPa左右,这说明在150℃以下淬火,连接试条具有较好的抗热循环冲击性能.
Water-quenching technique was used to evaluate the thermal shock behavior of the SiC-SiC joints joined with Na 2 O-B 2 O 3-SiO 2 glass solder.The microstructure of the side view of the interface and the fracture surface of the joints after quenching were analyzed.The influence of the quenching temperature and quenching cycles from 150℃ to cool water on the residual strength of the specimens were investigated.At the quenching temperature of 150℃,the residual strength of the joint decreased to（152±28） MPa due to the propagation of the microcracks in the interlayer caused by the thermal residual stress after one thermal cycle.At the quenching temperature from 150℃ to 320℃,the cracks seemed to be in subcritical state,and the residual strength was kept around 140 MPa.When the quenching temperature was increased to 420℃ or higher,the cracks propagation became more serious,and the strength decreased to（32±8） MPa rapidly.Moreover,the residual strength was hardly affected by the quenching cycles from 150℃ to cool water which meant that the joined specimens possesed good thermal shock resistance behavior at this temperature.
出处
《无机材料学报》
SCIE
EI
CAS
CSCD
北大核心
2012年第3期234-238,共5页
Journal of Inorganic Materials
基金
国家自然科学基金(50990301
51072210)~~
关键词
热震性
接口
残余弯曲强度
玻璃焊料
thermal shock resistance
joint
residual strength
glass solder
