3MILLER D S.Micro abrasive water-jet cutting[C]//Proceedings of the 2001 WJTA American Waterjet Conference.Minnesota,USA,2001:5.
4PERROTTET D,BUCHILLY J M,RICHERZHAQEN B et al.Water jet guided laser achieves highest die fracture strength[J].Future Fab International,2005,18:123-128.
5LLAMG W M.Thin wafer dicing issues and new technology cost of ownership[J].Future Fab International,2005,19(2):146.
6JIANG S,POPESU R,MIHAI C.High precision and high power ASJ simulations for semiconductor manufacturing[C]//Proceedings of the 2005 WJTA American Waterjet Conference.California,USA,2005:1A-3.
