摘要
研制了电子塑封料用线性高邻位热塑性酚醛环氧树脂 ,对影响反应的各种因素进行了探索 ,得到了制备线性热塑性酚醛环氧树脂的最佳工艺条件。研制出了较为适用的塑封料配方 ;塑封料所用全部原料均为国产料 ;利用自行研制的电子塑封料对半导体元器件进行了封装实验 ,结果显示塑封效果良好 ,完全可以替代进口塑封料。均苯四甲酸四 (2 乙基己基 )酯作为增韧剂用于塑封料属国内首创。
The linear and thermoplastic phenolic epoxy resin,which is used in electronics as plastic sealing materials has been prepared.The various influence factors on this reaction have been discussed.The optimum technological parameters for preparing this resin have been gained.Using the linear and thermoplastic phenolic epoxy resin,some proper preseriptions relating to the plastic sealing materials have been developed.All of the raw materials are made in China.By using these materials experiments to seal the semiconductor electronic devices have been made.It is showed that the developed materials could be substitute for the imported plastic sealing materials completely.Tetra-2-ethylhexyl pyromellitate being used as plasticizer is initiative in china.
出处
《化工科技》
CAS
2000年第1期12-16,共5页
Science & Technology in Chemical Industry
基金
山东省科学技术委员会资助
关键词
塑封料
热塑性
酚醛环氧树脂
增韧剂
电子器件
Plastic sealing
Linear and thermoplastic phenolic epoxy resin
Plasticizer
