摘要
文章介绍了半挠性覆铜板的应用,并研究了各种增韧剂对覆铜板配方挠曲性能的影响,在综合各种增韧剂的性能基础上开发出了高Tg半挠性覆铜板配方,可应用于刚挠结合板等领域。
The application of semi-flexible CCL was introduced in the article, and the influence of toughening agent on lfexibility of CCL was researched. High Tg and semi-lfexible CCL formula was developed under comprehensive research of many kinds of toughening agents, the formula can be used in rigid-lfexible printed circuit board.
出处
《印制电路信息》
2014年第3期17-19,共3页
Printed Circuit Information
