摘要
在化学镀Ｃｕ（Ｎｉ） － Ｐ合金镀液中添加碳化硅和聚四氟乙烯制得Ｃｕ（Ｎｉ） － Ｐ－ＳｉＣ－ ＰＴＦＥ复合镀层。研究了碳化硅、聚四氟乙烯的添加量对镀层沉积速度、硬度、磨损及减摩性能的影响。结果表明：碳化硅和聚四氟乙烯的加入能提高Ｃｕ（Ｎｉ） － Ｐ合金镀层的沉积速度、硬度、耐磨及减摩性。
Composite electroless nickel(copper)-phosphorus-silicon carbide-polytetrafluoro-ethylene deposits were prepared by adding silicon carbide and polytetrafluoro-ethylene into electroless nickel(copper)-phosphorus alloy baths. The effect of silicon carbide and polytetrafluoro-ethylene on deposition rate, microhardness, wear resistance and antifriction of obtained deposits were studied. The results indicate that electroless nickel(copper)-phosphorus alloy deposits are greatly improved in deposition rate, hardness, wear resistance and antifriction by codepositing proper amount of silicon carbide and polytetrafluoro-ethylene.
出处
《电镀与涂饰》
CAS
CSCD
2000年第1期1-4,18,共5页
Electroplating & Finishing
基金
安徽省自然科学基金!97416002
关键词
化学沉积
复合镀
碳化硅
聚四氟乙烯
镀层
电镀
electroless deposition
composite plating
silicon carbide
polytetrafluoro-ethylene
