摘要
虽然微型机电系统的制造通常使用基于集成电路工艺的平面制造技术,但由于MEMS器件的三维特性,使它与IC的制造有很大不同。而且,它涉及复杂的多能量域问题,给设计分析带来了较大难度。为加快MEMS的设计过程,需要有相应的计算机辅助设计系统(MEMSCAD)。
Although MEMS devices are generally fabricated using the surface micromachining technologies that develop from IC fabrication technologies. The 3D structures of MEMS and its coupled multi-energy-domain simulation introduce great difficulties for design and analysis. CAD systems designed specifically for MEMS are very important to enhance the design abilities of designers and accelerate the development of MEMS industry. This paper introduces the structure of CAD systems for MEMS and the status of present researches of MEMS CAD.
出处
《仪表技术与传感器》
CSCD
北大核心
2000年第1期1-3,7,共4页
Instrument Technique and Sensor
