期刊文献+

单轴应力锗能带结构研究 被引量:1

Energy-band structure for uniaxial stressed Germanium
原文传递
导出
摘要 用形变势理论讨论了单轴<001>和<110>及<111>张/压应力对锗导带各能谷(?能谷、?能谷及L能谷)能级的影响,采用包含自旋-轨道互作用及应力在内的六带k.p微扰法建立了单轴张/压应力作用下锗的价带结构模型,分析了锗价带带边能级随应力的变化情况,获得了锗导带底能谷能级分裂值、价带带边能级分裂值以及禁带宽度随应力的变化关系.量化数据可为单轴应力锗器件及电路的研究与设计提供参考. The influence of uniaxial stress along the001,110and111directions to the conduction band(CB)energy valley(Г valley,△ valleys,and L valleys)of Germanium was investigated by deformation potential theory.The valence band(VB)structure model of Germanium in uniaxial stressed was established by using a six-band k.p model and coupled with deformation potential theory,and the variation of valence band edge energy level with stress was analyzed.The uniaxial stress induced band edge structure change,such as CB splitting energy,VB splitting energy,and band-gap were elaborated.The obtained quantitative results can provide reference for the calculation of other physical parameters of uniaxial stressed Germanium.
出处 《中国科学:物理学、力学、天文学》 CSCD 北大核心 2012年第1期15-21,共7页 Scientia Sinica Physica,Mechanica & Astronomica
基金 国家部委资助项目(编号:61398,51308040106,9140C090303110C0904) 陕西省自然科学基础研究计划(编号:2010JQ8008)资助项目
关键词 单轴应力锗 能带结构 k·p微扰法 uniaxial stressed Germanium energy band structure k.p perturbation method
  • 相关文献

参考文献19

  • 1Thompson S E, Sun G Y, Choi Y S, et al. Uniaxial process induced strianed-Si: Extending the CMOS roadmap. IEEE Trans Electron Dev, 2006, 53(5): 1010-1020.
  • 2Lira J S, Thompson S E, Fossum J G. Comparision of threshold-voltage shifts for uniaxial and biaxial tensile-stressed n-MOSFETs. IEEE Electron Dev Lett, 2004, 25(11): 731-733.
  • 3Bedell S W, Daval N, Khakifirooz A, et al. New opportunities for SiGe and Ge channel p-FETs. Microelectron Eng, 2011, 88(4): 324-330.
  • 4Yang Y J, Ho W S, Huang C F. Electron mobility enhancement in strained-germanium n-channel metal-oxide-semiconductor field-effect transistors. Appl Phys Lett, 2007, 91(10): 102103.
  • 5Antoniadis D A, Aberg I, Chleirigh C N, et al. Continuous,MOSFET performance increase with device scaling: The role of strain and channell material innovations. IBM J Res Dev, 2006, 50(4): 363-376.
  • 6Mizutani T, Nakatsuka O, Sakai A, et al. Novel method to introduce uniaxial tensile strain in Ge by microfabrication of Ge/Si~_~Gex structures on Si(001) substrates. Solid State Electronics, 2009, 53(11): 1198-1201.
  • 7Takeuchi S, Sakai A, Nakatsuka O, et al. Tensile strained Ge layers on strain-relaxed Gel-xSnxvirtual Ge substrates. Thin Solid Films, 2008, 517(1): 159-162.
  • 8Shimura Y, Tsutsui N, Nakatsuka O, et al. Low temperature growth of Ge1-xSnx buffer layers for tensile-strained Ge layers. Thin Solid Films, 2010, 518(6): 52-55.
  • 9Weber O, Bogumilowicz Y, Emst T, et al. Strained Si and Ge MOSFETs with high-K/metal gate stack for high mobility dual channel CMOS. In: International Electron Devices Meeting, Washington D. C., 2005. 143-146.
  • 10Krishnamohan T, Krivokapic Z, Uchida K, et al. High-mobility ultrathin strained Ge MOSFETs on bulk and SOI with low band-to-band tunneling leakage: experiments. IEEE Trans Eiectron Dev, 2006, 53(5): 990-999.

二级参考文献9

  • 1胡辉勇,张鹤鸣,戴显英,吕懿,舒斌,王伟,姜涛,王喜媛.含有δ掺杂层的SiGe pMOS量子阱沟道空穴面密度研究[J].物理学报,2004,53(12):4314-4318. 被引量:7
  • 2李名复.半导体物理学[M].北京:科学出版社,1998.303-306.
  • 3胡辉勇 张鹤鸣 贾新章 戴显英 宣荣喜.半导体学报,2007,:2836-2836.
  • 4Shu Zh Y, Yang H D 2006 Chin. Phys. 15 1374
  • 5Chakraborty S, Bera M K, Bhattacharya S, Bose P K, Maiti C K 2006 Thin Solid Films 504 73
  • 6Guillaume T, Mouis M 2006 Solid-State Electronics 50 701
  • 7Smimov S, Kosina H 2004 Solid-State Electronics 48 1325
  • 8Levinshtein M E, Rumyantsev S L, Shur M S 2001 Properties of Advanced Semiconductor Materials ( New York : John Wiley & Sons)
  • 9Manku T, Nathan A 1991 Appl. Phys. 43 12634

共引文献20

同被引文献2

引证文献1

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部