摘要
本文用Ｘ射线衍射仪和透射电子显微镜研究了 Ｃｕ基体离子镀 Ａl膜的相结构及 晶体学位向关系。 Ｘ射线衍射分析结果表明了 Ｃｕ－Ａl过渡层中各合金相的存在并发 现负偏压和极间距是影响合金相形成的主要因素。两者的变化将影响表面温度的升高。 每一个Ｃu－Ａl合金相图中存在的中间相在Ｃｕ基离子镀Ａ１膜的过渡层中的存在都 对应一个温度区间．在极间距一定的情况下，该温度区间对应着负偏压的区间。极间距 加大，该负偏压区间升高。用透射电镜观察了一定工艺参数下的 Ｃu基离子镀 Ａl膜， 发现了与Ｘ射线分析结果相对应的一系列合金相的存在．它们是，ＡＬ＿４Ｃｕ＿９（Ｃｏｍｐｌｅx Ｃｕｂｉｃ），ＡlＣｕ_3（Ｏｒｔｈｏｒｈｏｍｂｉｃ），ＣｕＡ１_２（Ｐｒｉｍｉtｉｖｅ Ｔｅｔｒａgｎａｌ）， ＡlＣｕ （Primitive Monoclinie)及AlCu_4(Cubic).观察了合金相的形态并确定了合 金相与基体 Ｃｕ及股 Ａl 间的晶体学位向关系。
An X-ray diffractometer and a transmission were used to study the microstructures and the crystallographic relationships of Al film ion plated on Cu. The results show that there are the alloy phase in Cu-Al transition layers and it is discovered that the negative bias of the specimens and the distances between the columnar target and the specimens (pole-distances) are the main factors affecting the formation of the alloy phases. A change of the two factors will affect arising the temperature of the specimens surfaces. There is a correspond temperature region for each inter phase which exists in the Cu-Al alloy phase diagram in the intermediate layer of the ion-plated Al/Cu films. The temperature region is correspondent with the regions of the negative bias on the specimens when the pole-distance is constant. If the pole-distance is enlarged the region of the negative bias will arise. The phase structures of the transition layers of the ion-plated Al/Cu films at certain parameters, were characterised with TEM, it is discovered that there is a serious alloy phases in correspondance with the results of X-ray analysis. They are Al_4Cu_9 (complex cubic), AlCu_3 (orthorhombic), CuAl_2 (primitive tetragnal), AlCu (primitive monoclinic) and AlCu_4(cubic)etc. The morphologies of the alloy phases were observed and the relation among the alloy phase,the crystallographic direction and substrate (Cu) were identified.
出处
《真空》
CAS
北大核心
1990年第4期43-47,共5页
Vacuum
基金
国家自然科学基金资助项目
