摘要
快速凝固法是制备细晶和超细晶Cu-Cr合金的重要工艺技术之一。快速凝固技术包括甩熔技术、雾化技术、喷射沉积技术、激光技术等,能够将晶粒从几百微米减小至几微米,甚至100 nm以下,从而使Cu-Cr合金的综合性能得以全面提高。为了更好地利用此方法制备细晶和超细晶Cu-Cr合金,结合国内外Cu-Cr合金有关文献的研究成果,综述了快速凝固法在Cu-Cr高压真空触头材料方面的应用研究现状,比较几种方法的技术特点和性能,以便为今后开展Cu-Cr合金的微晶、超微晶的研究提供一定的参考。
Rapid solidification technology is an important technique for preparing fine-grain and superfine-grain Cu-Cr alloys, including melt-spinning, atomization, spray deposition and laser technology, etc. The grain sizes of the Cu-Cr alloys thus prepared could be reduced from hundreds of micrometers to several micrometers or even to less than 100 nanometers, so that the overall performance of Cu-Cr alloys can be improved. In order to facilitate the preparation of the fine-grain or superfine-grain Cu-Cr alloys, we summarize the researches and applications of the rapid solidification methods to Cu-Cr contact materials for high-voltage and vacuum condition, and compare their technical features.
出处
《高压电器》
CAS
CSCD
北大核心
2011年第12期80-85,共6页
High Voltage Apparatus
关键词
快速凝固
细晶
超细晶Cu-Cr合金
真空触头
rapid solidification
fine-grain
superfine-grain Cu-Cr alloy
vacuum contact
