摘要
铜基金刚石复合材料可结合铜与金刚石的优良物理性能,实现航空电子系统及其元器件轻质、高导热、低膨胀的性能要求。考察了复合电沉积工艺对复合材料金刚石质量分数和致密度的影响;通过对埋砂复合电沉积的预镀时间、上砂镀时间以及加厚镀时间等工艺参数的优化,获得金刚石分布均匀,致密度较高的铜基金刚石复合材料;并根据3种粒径金刚石的埋砂工艺参数拟合了金刚石粒径与复合电沉积工艺的关系。
Cu-diamond composite are expected to combine the advantages of copper and diamond to achieve the performance of low density,high thermal conductivity,and low thermal expansion.Composite electrolytic deposition is a promising technique for preparing Cu-diamond composite.The influences of inter-sand process parameters towards diamond content and bulk density for composites were studied,and then the inter-sand process parameters were optimized.Cu-diamond composite with uniform distribution diamonds inside and a high bulk density were achieved under optimized inter-sand process parameters.The relationships between optimized inter-sand process parameters and diamond diameter were also simulated in this paper.
出处
《功能材料》
EI
CAS
CSCD
北大核心
2011年第10期1864-1868,共5页
Journal of Functional Materials
基金
航空科学基金资助项目(20095221004)
关键词
铜-金刚石复合材料
埋砂复合电沉积
埋砂工艺
金刚石质量分数
致密度
Cu-diamond composites
composite electrolytic deposition
inter-sand process parameters
diamond content
bulk density
