摘要
采用粉末冶金法制备Cu/SiO2纳米复合材料,研究SiO2含量对复合材料性能的影响。结果表明,在烧结过程中,Cu/SiO2复合材料的体积收缩,密度增加,并且随SiO2含量提高,Cu/SiO2纳米复合材料的电导率降低,维氏硬度和机械性能明显升高。退火温度曲线表明,Cu/SiO2复合材料的软化温度为750℃,高于纯铜的软化温度150℃,具有很好的热稳定性。
The SiO2 nanoparticles reinforced Cu-matrix composites are prepared by powder metallurgy technology. The influences of SiO2 content on the properties of Cu-matrix composites are studied. The experimental results show that the volumes of Cu/SiO2 nanocomposites are contracted and the densities increased after sintering. With the increase of the SiO2 content, the conductivity rate of the composite is decreased, whereas the hardness and mechanical properties are obviously increased. It is indicated by the annealing temperature curve that the high temperature stability of the Cu/SiO2 nanocomposite is excellent, the intenerating temperature is about 750℃ far higher than that of pure copper, 150℃.
出处
《有色金属》
CAS
CSCD
北大核心
2007年第1期38-40,共3页
Nonferrous Metals
基金
安徽省"十五"二期科技攻关项目(040020392)
合肥市重点科技攻关项目(20051004)
